Liquid silicone bag FPC

Liquid silicone encapsulation of FPC (Flexible Printed Circuit) is a precision molding process that applies a thin layer of liquid silicone rubber over flexible circuit boards. This encapsulation provides superior protection against moisture, dust, vibration, and mechanical stress while maintaining the flexibility of the underlying circuit.

Benefits include complete environmental sealing (IP67/IP68 rated), excellent dielectric insulation, flexible protection that moves with the circuit, thermal stability from -60C to +200C, and ideal for wearable electronics, automotive sensors, and medical devices.